Face-up fan-out electronic package with passive components using a support

ABSTRACT

A face-up fan-out electronic package including at least one passive component located on a support. The electronic package can include a die. The die can include a plurality of conductive pillars having a proximal end communicatively coupled to the first side of the die and a distal end opposite the proximal end. A mold can at least partially surround the die. The mold can include a first surface that is coplanar with the distal end of the conductive pillars and a second surface opposing the first surface. In an example, the passive component can include a body and a lead. The passive component can be located within the mold. The lead can be coplanar with the first surface, and the body can be located at a distance from the second surface. The support can be located between the body and the second surface.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/703,315, filed Dec. 4, 2019, which is a continuation of U.S. patentapplication Ser. No. 15/857,189, filed Dec. 28, 2017, now issued as U.S.Pat. No. 10,546,817, each of which is incorporated by reference hereinin its entirety.

TECHNICAL FIELD

This document pertains generally, but not by way of limitation, toelectronic packaging, such as face-up fan-out electronic packaging.

BACKGROUND

Fan-out semiconductor packaging (e.g., fan-out wafer-level packaging)can use wafer processing technology to construct interconnect featuresof an electronic package. Accordingly, interconnections having a reducedlength and increased density can be provided as compared to otherpackaging configurations, such as wire bonded or flip-chip packages. Atleast two configurations of fan-out packaging can be utilized. Thoseconfigurations include face-down and face-up fan-out packages. Face-downpackages are constructed by placing a die (or other semiconductordevice) on to a carrier with conductive pillars or conductive 25bondpads of a die facing the carrier. The carrier can then be populatedwith other components, such as passive components, also having leads(e.g., conductive leads) placed on to the carrier. The carrier, die, andother components are then molded, and the carrier is removed.Accordingly, the conductive pillars and component leads are exposed forassembly with a redistribution layer. Because the die and other 30components are often attached to the carrier with an adhesive, theconductive pillars and component leads can protrude from the mold. Insome instances, the pitch of the conductive pillars and component leadsare increased to accommodate locational tolerances related to theface-down process.

Face-up configurations can be constructed by placing the die with theconductive pillars facing away from the carrier. After the mold isapplied, the conductive pillars can be exposed for furtherinterconnection by cutting or lapping or grinding operation. This canmitigate the technical challenge posed by the topography of theconductive pillars and component leads relative to the mold surface inface-down configurations. However, other challenges can occur if othercomponents are desired within the face-up packages. For instance, whenother components are placed face-up (e.g., with the leads facing awayfrom the carrier), the leads of the component and the conductive pillarsmay not be aligned. Consequently, when the cutting or grinding operationis performed, some of the conductive pillars and component leads may notbe exposed through the mold. This lack of alignment provides challengesin electrically coupling both the die as well as other components to theredistribution layer. Accordingly, packaging configurationsincorporating other components, such as passive components, into face-upfan-out electronic packages would be desirable.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 illustrates an example of an electronic package including asupport for a passive component, according to an embodiment.

FIG. 2 depicts an example of an electronic package including a supportframe for a passive component, according to an embodiment.

FIG. 3 illustrates another example of an electronic package including asupport frame for a passive component, according to an embodiment.

FIG. 4 depicts an example of an electronic package including a supportfor a passive component having a via, according to an embodiment.

FIGS. 5A-5F illustrate a process for making an electronic packageincluding a support for a passive component, according to an embodiment.

FIG. 6 illustrates a system level diagram in accordance with someembodiments of the invention.

DETAILED DESCRIPTION

The present application relates to devices and techniques for a face-upfan-out electronic package, such as a face-up fan-out electronic packageincluding a support for holding a passive component. The followingdetailed description and examples are illustrative of the subject matterdisclosed herein; however, the subject matter disclosed is not limitedto the following description and examples provided. Portions andfeatures of some embodiments may be included in, or substituted for,those of other embodiments. Embodiments set forth in the claimsencompass all available equivalents of those claims.

The present inventors have recognized, among other things, that atechnical challenge can include electrically coupling one or morepassive components to a redistribution layer of a face-up fan-outelectronic package. The present subject matter can provide a solution tothis problem. In an example, a support can be included in a face-upfan-out electronic package to hold one or more passive components. Thesupport can position a lead of the passive component to be coplanar witha flat mounting surface of the electronic package. Accordingly, the oneor more passive components and the die can be electrically coupled to aredistribution layer located along the flat mounting surface. Theplanarity of the flat mounting surface (including the coplanar leads andconductive pillars of a die) can provide for smaller pitches between theleads, conductive pillars, and combinations thereof. In a furtherexample, a through-mold via that is coplanar with the flat mountingsurface can provide an electrical connection between the flat mountingsurface and the one or more leads of the passive components.Accordingly, passive components can be integrated into face-up fan-outelectronic packages, and the footprint of the electronic package can bereduced, or electrical connections can be shortened (e.g., to increaseelectrical performance), or combinations thereof.

FIG. 1 illustrates an example of an electronic package 100 including atleast one support for one or more passive components. For instance, inthe example of FIG. 1, the electronic package 100 can be a face-upfan-out electronic package. The electronic package 100 can include atleast one die, mold, passive component, and support. As shown in theexample of FIG. 1, the electronic package 100 includes a die 102 havinga first side 104 and a second side 106. A plurality of conductivepillars (e.g., conductive pillars 108) can be coupled to the die 102.For instance, each conductive pillar 108 can include a proximal end 110and a distal end 112. The proximal end 110 can be communicativelycoupled to the first side 104 of the die 102 (e.g., a semiconductordevice within the die 102. A mold, such as mold 114, can at leastpartially surround the die 102. The mold 114 can include a first surface116 that is coplanar with the distal end 112 of the conductive pillars108 and a second surface 118 opposing the first surface 116. A passivecomponent, such as passive component 124A or 124B, can be located withinthe mold 114. The passive component can include a body (e.g., body 126Aor 126B) and at least one lead (e.g., lead 128A or 128B). The lead canbe coplanar with the first surface 116. Where the body has a dimensionthat is less than the thickness of the mold, the body can be located ata distance from the second surface 118. To hold the passive component, asupport can be located between the body at the second surface 118. Atleast one routing layer 122 can be electrically coupled to one or moreof the distal ends 112 of the conductive pillars 108.

The die 102 can include a processor (e.g., graphics processing unit(GPU) or central processing unit (CPU)), memory package (e.g., randomaccess memory (RAM), flash memory, read only memory (ROM)), or otherlogic or memory package. As previously described, the die 102 caninclude the first side 104 (e.g., active side) and the second side 106(a second die side) opposing the first side 104. The plurality ofconductive pillars 108 can be attached to the first side 104 of the die102. For instance, the plurality of conductive pillars 108 can beelectrically coupled to respective contacts along the first side 104 forcommunicatively coupling the die 102 to an electronic device. Theconductive pillars 108 can be an electrically conductive material, suchas copper, and can be deposited on the contacts of the die 102. In anexample, the conductive pillars 108 can be plated on to the firstsurface 104 of the die 102. For instance, the conductive pillars 108 canbe constructed by a process including, but not limited to,electroplating, electroless plating, sputtering, vapor deposition, ordeposition by other plating processes. The one or more conductivepillars 108 can include the proximal end 110 and the distal end 112. Theproximal end 110 can be attached to the first side 104 and the distalend 112 can be located at an opposing end of the proximal end 110.

The mold 114 can partially surround the die 102 to protect and providestructural support for the die 102 and the plurality of conductivepillars 108. In some examples, the mold 114 can be constructed from amaterial including, but not limited to, epoxy, polymer, or other moldcompound. The mold 114 and can be constructed by processes including,but not limited to, compression molding, injection molding, stencilprinting, potting, or the like. In the example of FIG. 1, the mold 114can surround the die 102 on five sides with the second side 106 of thedie 102 exposed through the mold 114 (e.g., not covered by the mold). Inother words, the mold 114 can have a first surface 116 and a secondsurface 118. The first surface 116 can be coplanar with the distal end112 of the one or more conductive pillars 108. The second side 106 ofthe die 102 can be located along the second surface 118 of the mold 114.As used herein, the term coplanar refers to surfaces that aresubstantially parallel (e.g., are parallel within 1 micron or less).When referring to a location that is along the surface, a parallelrelationship also exists with a wider tolerance range than coplanarfeatures. For instance, the features can be parallel within 20 microns

In an example, the mold 114 can be applied to the die 102 after theconductive pillars 108 are attached to the die 102. The first surface116 of the mold 114 and the distal end 112 of the conductive pillars 108can be cut, ground, lapped, polished, or any combination thereof toprovide a flat mounting surface 1. For example, the flat mountingsurface 120 includes the first surface 116 of the mold 114 that iscoplanar with the distal end 112 of the conductive pillars 108. Thus,the flat mounting surface 120 can have a planarity of less thantwo-microns (e.g., corresponding to the coplanarity of the distal end112 of the conductive pillars 108 and the first surface 116 of the mold114). Accordingly, the mold 114 can be located between the plurality ofconductive pillars 108. For instance, the mold 114 can be locatedbetween the distal end 112 and the proximal end 110 of the plurality ofconductive pillars 108.

As the pitch P of the conductive pillars 108 decreases, variation withinthe locations of the distal ends 112 of the conductive pillars 108,variation within the planarity (e.g., flatness) of the first surface116, or variation in the location of the distal end 112 of theconductive pillars 108 along the first surface 116 can result in defectsin the electrical coupling of the conductive pillars 108 to the routinglayer 122. The coplanar relationship between the distal end 112 of theat least one conductive pillar 108 and the first surface 116 of the mold114 can provide the flat mounting surface 120 for coupling the moldeddie (the die 102 located within the mold 114) to the one or more routinglayers 122. Accordingly, defects related to electrical coupling can bereduced and the pitch P of the conductive pillars 108 can be decreased.

The electronic package 100 can include a passive component or aplurality of passive components located within the mold 114. In theexample of FIG. 1, the electronic package 100 includes two passivecomponents, such as a first passive component 124A and a second passivecomponent 124B. The passive components can include, but are not limitedto, a resistor, capacitor, inductor, or other type of passive component.Each of the passive components can include a body and at least one lead.For instance, the first passive component 124A includes a first body126A and a first lead 128A, and the second passive component 124Bincludes a second body 126B and a second lead 128B. In the example ofFIG. 1, each passive component can include two leads. The passivecomponents can be located within the mold 114 so the one or more leads(e.g., 128A or 128B) can be coplanar with the first surface 116.

In an example, one or more of the passive components can be located at adistance from the second surface 118 of the mold 114. For instance, inthe example of FIG. 1, the first body 126A (e.g., a side of the passivecomponent opposite of the one or more leads) of the first passivecomponent 124A can be located at a distance D1 from the second surface118 of the mold 114. The second body 126B of the second passivecomponent 124B can be located at a distance D2 from the second surface118. The second body 126B can have a smaller dimension H2 than thedimension H1 of the first body 126A. In other examples, a second die ora plurality of additional dies can be located within the mold 114. Thecorresponding conductive pillars or leads of the additional dies can becoplanar with the first surface of the mold 116.

The electronic package 100 can include a support or a plurality ofsupports. In the example of FIG. 1, the electronic package 100 includestwo supports, such as the first support 130A and the second support130B. One or more of the supports can hold the passive component (e.g.,passive component 124A or 124B) within the mold 114 at a distance (e.g.,distance D1 or D2) from the second surface 118. Accordingly, one or moreof the leads (e.g., leads 128A or 128B) can be coplanar with the firstsurface 116 of the mold 114. The supports, such as support 130A or 130B,can be located between the second surface 118 and the passive component,such as passive components 124A or 124B respectively. For instance, inthe example of FIG. 1, the first support 130A can be located between thesecond surface 118 and the first passive component 124A, and the secondsupport 130B can be located between the second surface 118 and thesecond passive component 124B. A first end of the support can be coupledto the passive component and a second end of the support can be locatedalong or coplanar with the second surface 118. For instance, a first end132A of the first support 130A can be coupled to the first passivecomponent 124A, and a second end 134A of the first support 130A can belocated along or coplanar with the second surface 118. A first end 132Bof the second support 130B can be coupled to the second passivecomponent 124B, and a second end 134B of the second support 130B can belocated along or coplanar with the second surface 118. For example, oneor more of the supports can be exposed through the second surface 118.In other words, in some examples, one or more of the second ends (e.g.,134A or 134B) of the respective supports are not covered by the mold114.

In various examples, the supports can include different lengths. Forinstance, at least one support can have a different height than one ormore of the other supports. In the example of FIG. 1, where the body126B of the second passive 124B has a smaller dimension H2 than thedimension H1 of the body 126A of the first passive 124A. The firstsupport 130A can include a height L1 to support the first passivecomponent 124A, and the second support 130B can include a longer heightL2 to support the second passive component 124B.

The one or more supports (e.g., supports 130A or 130B) can beconstructed from a material including, but not limited to, a metal, suchas copper, steel, aluminum; a polymer; or other materials. The materialof the supports can be selected to reduce the effect of thermalexpansion on the location of the passive component during theconstruction or use of the electronic package 100. In other words, thematerial of the support can be selected to increase the dimensionalstability of the location of the passive component with respect to thefirst surface 116 of the mold 114 and the distal end 112 of theconductive pillars 108. In an example, the material of the support canalso help to maintain the dimensional stability of the die 102 and keepin from moving during the molding process. Accordingly, the supports130A, 130B can hold the location of the one or more passive componentsat a distance, such as the distance D1 or D2 with respect to the secondsurface 118 so the leads 128A, 128B of the respective passive components124A, 124B are coplanar with the first surface 116 (e.g., the flatmounting surface 120).

An adhesive can be located between the support and the passivecomponent. The adhesive can hold the passive component on the support,for instance, during or after the application of the mold. As shown inthe example of FIG. 1, an adhesive 136A can coupled between the support130A and the passive component 124A. An adhesive 136B can be coupledbetween the support 130B and the passive component 124B. The adhesive(e.g., adhesive 136A or 136B) can include, but is not limited to, afilm, liquid coating, or other form of adhesive disposed between thepassive component and the support. In a further example, the support caninclude a solder coating to hold the passive component on the support.In an example, the adhesive can be a pressure sensitive film applied tothe first end of the support and bonded to the passive component. Insome examples, the adhesive can electrically isolate the passivecomponent from the support.

At least one routing layer 122 can be electrically coupled to one ormore of the distal ends 112 of the conductive pillars 108. The routinglayer can include, but is not limited to one or more electricallyconductive pathways, such as one or more copper traces. The leads (e.g.,leads 128A or 128B) of the passive components (e.g., 124A or 124B) canalso be electrically coupled to one or more routing layers as shown inthe example of FIG. 1. The routing layer 122 can include a plurality ofcontacts 138 to communicatively couple the die 102 or at least one ofthe passive components 124A, 124B to an electronic device. For instance,a plurality of solder balls 140 or controlled collapse chip connections(also known as a C4 interconnects or a flip chip interconnects) can beelectrically coupled to the routing layer 122.

In some examples, a dielectric layer 142 can be disposed between thesecond surface 118 and the routing layer 122. For instance, the routinglayer 122 and the dielectric layer 142 can be included in aredistribution layer, substrate, printed circuit board (PCB), bumplessbuildup layer (BBUL) flexible circuit, or the like that includes therouting layer 122. For instance, the electronic package can include aredistribution layer, substrate, printed circuit board (PCB), bumplessbuildup layer (BBUL) flexible circuit, or the like, that includes therouting layer and the dielectric layer. To be compatible with theelectronic device, the electrical contacts 138 can have a differentsize, pattern, or location than the conductive pillars 108 or the lead(e.g., 128A or 128B) of the passive components (e.g., 124A or 124B).Accordingly, the routing layer 122 can provide an interface toelectrically couple the electronic package 100 to an electronic device.

In various examples, the electronic package 100 can be a fan-outpackage. In the example of FIG. 1, the electronic package 100 is aface-up fan-out package. In some instances, the pitch P between theconductive pillars or the leads can be increased to accommodatevariation in the planarity among the second surface 118 and the distalend 112 of the conductive pillars 108. The flat mounting surface 120(e.g., the coplanar second surface 118, distal end 112 of the conductivepillars 108, and leads 128A, 128B) of the present disclosure can providefor reduced variation in the planarity (e.g., parallelism) of the secondsurface 118 and the plurality of conductive pillars or leads. Reducingthe variation in planarity can mitigate defects related to placementlocation, electrical shorting between conductive pillars or leads,insufficient electrical connections, or other connection or solderingissues. Accordingly, the pitch P between the conductive pillars, leads,or various combinations thereof can be decreased. Decreasing the pitchcan provide for smaller overall package sizes.

FIG. 2 depicts an example of another electronic package 200 including asupport frame 244 for the one or more passive components 124A, 124B. Amold 214 can at least partially surround the die 102 and the distal end112 of the plurality of conductive pillars 108 can be located coplanarwith a first surface 216 of the mold 214. The second side 106 of the die102 can be located along a surface of the support frame 244. The supportcan have a first surface 246 and a second surface 248. In some examples,the first surface 246 or the second surface 248 can be planar. The firstsurface 246 of the support frame 244 can be located along the secondsurface 218, and the second surface 248 of the support frame 244 can belocated in parallel with the second side 106 of the die 102. In someexamples, the support frame 244 can be located along the entirety of thesecond surface 218 or along a portion of the second surface 218. Thesupport frame 244 can include various shapes and configurations. Forinstance, the support frame 244 can include, but is not limited to, asolid panel, a panel with one or more apertures, or one or more stripsof material.

The support frame 244 can include the one or more supports, such assupport 230A or support 230B. The supports 230A, 230B can includeaspects of supports 130A or 130B as shown and described herein. Forinstance, the supports 230A, 230B can be coupled to the first surface246 opposing the second surface 248. In some examples, the support frame244 can hold the one or more supports 230A, 230B in fixed relation. Inan example, the one or more supports can be extended from the firstsurface 246, such as transverse or perpendicular to the first surface246.

The die 102 can be coupled to the support frame 244. For instance, anadhesive or die attach film can couple the second side of the die 106 tothe support frame 244. Changes in temperature or curing of the mold canresult in shifting of the relative positions of the die 102, supports(230A, 230B), or passive components (124A, 124B). For instance,differences in the coefficient of thermal expansion (CTE) can lead toshifting in the relative position of the die, supports, or passivecomponents. In an example, a material of the support frame 244 can beselected to reduce shifting among the die, supports, or passivecomponents. The material of the support frame 244 or the supports caninclude, but is not limited to, copper, stainless steel, aluminum, orthe like. Accordingly, the support frame 244 can hold the die, supports,or passive components in position to reduce the amount of shift inrelative position.

In the example of FIG. 2, the support frame 244 can include a die holder250. The die holder 250 can anchor the die 102 within the electronicpackage 200 to reduce the relative location shift among the die,supports, and one or more passive components. In various examples, thedie holder 250 can include, but is not limited to, an aperture, one ormore ribs, gussets, pins, or the like. The location of the die 102 onthe support frame 244 can be constrained by the die holder 250. Forinstance, the location of the die 102 with respect to the support frame244 can be constrained within a tolerance range. Accordingly, the amountof location shift of the die 102 (e.g., corresponding to temperaturechanges or mold curing) with respect to the support frame 244, thesupports, and passive components can be reduced. In other words, the dieholder 250 can increase the locational stability of the die 102 withrespect to the supports or the passive components. Reducing the amountof location shift can provide a decrease in defects related to placementlocation, electrical shorting between conductive pillars (e.g.,conductive pillars 108), electrical shorting between leads, insufficientelectrical connections, or other defects related to connection orsoldering. In some examples, the pitch (e.g., pitch P) among theconductive pillars, leads, or various combinations thereof can bedecreased corresponding to the reduction of the location shift.Decreasing the pitch can provide for smaller overall package sizes asthe die or corresponding passive components can either be shrunk in sizeor arranged closer together in a smaller package design.

FIG. 3 illustrates an example of an electronic package 300 includinganother example of a support frame 344. The support frame 344 caninclude the features of the support frame 244 from the example of FIG.2. In the example of FIG. 3, portions of the support frame 344 have beenremoved. For instance, as shown, portions of the support frame 344previously coupled to the supports 130A, 130B have been removed, forexample, to electrically or thermally isolate the support frame 344 fromthe supports 130A, 130B or the passive components 124A, 124B. In otherexamples, the support frame 344 can include the supports 130A, 130B asshown in the example of FIG. 2. In some examples, the support frame 344can be electrically coupled or thermally coupled to the supports, thepassive components, or a combination thereof. The support frame 344 canbe located along the second surface 106 of the die 102. For instance,the support frame 344 can be attached, electrically coupled, orthermally coupled to the second side 106. In an example, the supportframe 344 can be thermally coupled to the second side 106 fordissipating heat from the die 102. In other words, the support frame 344can be a heatsink configured to transfer heat from the die 102. Forinstance, the support frame 344 can be constructed of a thermallyconductive material, such as copper or aluminum. In a further example,the support frame 344 can include a sufficient thermal mass or caninclude fins or other geometry configured to increase the transfer ofheat from the die 102 through the support frame 344.

In some examples, the support frame 344 can be electrically coupled to acircuit to route electrical signals. For instance, the support frame canbe electrically conductive and configured to communicate electricalsignals of the die 102, the routing layer 122, or the one or morepassive components (e.g., 124A, 124B). In an example, the die 102 caninclude one or more through silicon vias that are electrically coupledto the support frame 344. In an example, the support frame 344 can beelectrically coupled to one or more of the routing layers 122. In afurther example, the support frame 344 can be a ground plane for one ormore circuits of the electronic package 300. In other examples, one ormore passive components can be communicatively coupled to the die 102through the support frame 344. For instance, the support (e.g., support130A, 130B) can be electrically coupled to a lead (e.g., lead 128A,128B) and the die 102 can be electrically coupled to the support throughthe support frame 344.

FIG. 4 depicts a cross section of another example of an electronicpackage 400. The electronic package 400 includes at least one passivecomponent having a lead within a mold 414. In the example of FIG. 4, theelectronic package 400 includes a first passive component 424A and asecond passive component 424B. The lead of the passive component can beoffset from the first surface 416 at a spacing S. In some instances,removing material from the lead of the passive component to form theflat mounting surface, such as the flat mounting surface 120 shown inthe example of FIG. 1, can cause the lead to lose structural integrityor can cause the removal of the lead entirely. In other examples,removing material can cause the removal of a portion of the body of thepassive component. Offsetting the lead at a distance S within the mold414 can mitigate the possibility of removing material from the passivecomponent. A through mold via 452A, 452B can be located between at leastone lead of the passive component 424A, 424B and a first surface 416 toelectrically couple the passive component to one or more routing layersand correspondingly the electronic device. Accordingly, the through-moldvia (e.g., through-mold via 452A, 452B) can include a first end 454A,454B that is coplanar with the first surface 416 and a second end 456A,456B electrically coupled to the respective leads 428A, 428B.Accordingly, the electronic package 400 can include a flat mountingsurface 420 for electrically coupling a die 402 and one or more passivecomponents 424A, 424B to the one or more routing layers 422.

Where the through-mold via 452A, 452B provides an electrical connectionbetween the flat mounting surface 420 and the one or more leads of therespective passive components, the passive components can be located atvarious positions within the mold. Accordingly, the passive component isnot limited to locations where the lead of the passive component iscoplanar with the first surface 416. For instance, as shown in theexample of FIG. 4, the passive component 424A or passive component 424Bcan be positioned on a support 430A or a support 430B respectively. Theheight of the supports can be configured to position the leads withinthe mold. Accordingly, the passive component can be located at adistance from the second surface 418. In other examples, one of skill inthe art would recognize that the passive component could be locateddirectly along the second surface 418. In this example, the passivecomponent can be exposed through the second surface 418 due to theprocess of constructing the electronic package.

FIGS. 5A-5F illustrate a process for making an electronic package 500including a support for a passive component, such as the electronicpackages 100, 200, 300, and 400 previously described in the examplesherein and shown for instance in FIGS. 1-4. In describing the process,reference is made to one or more components, features, functions, andprocesses previously described herein. Where convenient, reference ismade to the components, features, processes and the like with referencenumerals. Reference numerals provided are exemplary and arenonexclusive. For instance, features, components, functions, processes,and the like described in the process include, but are not limited to,the corresponding numbered elements provided herein. Other correspondingfeatures described herein (both numbered and unnumbered) as well astheir equivalents are also considered.

As depicted in FIG. 5A, a support frame 544 can be attached to a carrier558. For instance, the support frame 544 can be attached to the carrier558 with an adhesive 560, such as a pressure sensitive film, die attachfilm, spray, coating, or other type of adhesive. The support frame 544can include at least one support 530 as previously described in theexamples of FIGS. 1-4. In an example, the one or more supports 530 canbe constructed on the support frame 544 by additive or subtractiveprocesses, such as etching, machining, plating, or the like. In furtherexamples, attaching the support frame 544 to the carrier 558 can includeconstructing the support frame 544 on the carrier in situ. The carrier558 can include a sheet constructed of stainless steel, aluminum,copper, or other material for providing support and rigidity to thesupport frame 544. In the example of FIG. 5A, a support frame panel 562can be attached to the carrier 558. The support frame panel 562 caninclude a plurality of support frames 544. For instance, the pluralityof support frames 544 can be arranged as a single component into thesupport frame panel 562. Accordingly, a plurality of electronicpackages, such as electronic packages 100, 200, 300, or 400, can beconstructed on a single carrier 558.

At FIG. 5B, a die can be attached to the support frame 544 or thecarrier 558. In an example, a plurality of dies 502A-C can be attachedto the support frame 544 or the support frame panel 562, as depicted inFIG. 5B. For example, a second side 506 of the one or more dies can becoupled to the support frame 544, such as bonded with die attach film orother adhesive to the support frame 544, as shown in the example of FIG.5B. A first side of the die 504 (e.g., the active side including one ormore conductive pillars 508) can be facing away from the support frame544 (e.g., upward). In examples where the support frame 544 includes adie holder feature (e.g., an aperture in the support frame) the one ormore dies 502A-C can be coupled directed to the carrier 558 with anadhesive (e.g., die attached film) as previously described.

As shown in the example of FIG. 5B, at least one passive component 524can be placed on a first end 532 of the support 530. In some examples,the passive component 524 can be coupled to the first end 532 with anadhesive 536, such as the adhesive previously described herein. Theadhesive 536 can be located between the passive component 524 and thefirst end 532.

At 5C, a mold 514 (e.g., molding material) can be disposed over the die(e.g., dies 502A-C), conductive pillars 508, supports 530 (and in someexamples, support frame 544 or support frame panel 562), and passivecomponent 524. In some examples, the mold 514 can be epoxy, polymer, orother mold compound and can be constructed by processes including, butnot limited to, compression molding, injection molding, potting, or thelike. In an example, by anchoring the die (e.g., one or more of dies502A-C) and the passive component 524, the support frame 544 can toreduce location shifting of the die (or dies 502A-C) during moldapplication or curing.

As shown in the example of FIG. 5D, material can be removed from a lead528 of the passive component 524, distal end 512 of the conductivepillar 508, and the mold 514 to form a flat mounting surface 520. Forinstance, the mold 514, the lead 528, and the distal end 512 of theconductive pillars 508 can be cut, ground, polished, or any combinationthereof to provide the flat mounting surface 520. Removal of materialfrom the mold 514 can form the first surface 516 of the mold 514. In anexample, the flat mounting surface 520 can have a planarity of less thantwo-microns (e.g., corresponding to the parallelism of the distal end ofthe conductive pillars 512 and the first surface 516). Accordingly, thepitch of the conductive pillars 508, the leads 528, or a combinationthereof can be reduced. In a further example, defects related toelectrically coupling the die 502 or passive component 524 to a routinglayer (e.g., routing layer 522 shown in FIG. 5F) can be reduced.

At FIG. 5E, the carrier 558 can be removed from the second surface 518,support frame 544, support 530, support frame panel 562, die (e.g.,502A, B, C), or a combination thereof. In an example, heat can beapplied to release the adhesive 560 between the carrier 558 and thesecond surface 518. The heat can cause thermal degradation of theadhesive 560 to release the carrier 558. In other examples, the carriercan be removed mechanically, by using a chemical solvent, or by othermethods of separation.

In various examples, at least a portion of the support frame 544 can beremoved or the whole support frame 544 can be removed from the secondsurface 518. For instance, the support frame 544 can be etched ormechanically removed. Accordingly, the dimensions (e.g., thickness) ofthe electronic package can be reduced, or the supports 530 can beseparated from one another. In some examples, a portion of the supportframe 544 is removed and the remaining portion can be used as a groundplane or a heatsink as previously described herein and shown in theexample of FIG. 3. In examples including a support frame panel 562 and aplurality of dies (e.g., 502A-C), a portion of the support frame panel562 or the entire support frame panel 562 can be removed before theplurality of electronic packages are separated from one another.

In the Example of FIG. 5F, at least one routing layer 522 can beelectrically coupled to the die through at least one respectiveconductive pillar 508 or electrically coupled to at least one of thepassive components 524 through one or more of the leads 528. In anexample, the routing layer 522 can be disposed on the first surface 516.In some examples, a dielectric layer 542 can be disposed between thefirst surface 516 and the routing layer 522. For instance, the routinglayer 522 and the dielectric layer 542 can be included in aredistribution layer, substrate, printed circuit board (PCB), bumplessbuildup layer (BBUL) flexible circuit, or the like. In some examples, aplurality of solder balls 540 can be electrically coupled to thecontacts of the routing layer 522 for electrically coupling theelectronic package to the electronic device.

In examples including a support frame panel 562, where a plurality ofelectronic packages 500A-C are constructed on the carrier 558, thesupport frame panel 562 and mold 514 can be separated into a pluralityof electronic packages 500A-C. In an example, each electronic packagecan include at least one die (e.g., die 502A, B, or C), at least onesupport 530, and at least one passive component 524. The electronicpackages 500A-C can be separated by cutting the mold 514, and in someexamples, the support frame 544, one or more routing layers 522, one ormore dielectric layers 542, or a combination thereof. As shown in theexample of FIG. 5F, the electronic packages can be separated along thecutting planes 564, 566.

In an example, a protection layer can be disposed along the flatmounting surface 520 (e.g., the first surface 516, distal end 512 of theconductive pillars 508, and leads 528). The protection layer can coverthe leads 528 and conductive pillars 508 during the removal of thesupport frame 544, a portion of the support frame 544, or removal of thecarrier 558. Accordingly, the protection layer can shield the leads 528and conductive pillars 508 from damaged caused by further processing ofthe electronic package, such as the removal of the carrier 558, supportframe 544, or the like. In an example, the protection layer can beremoved after the support frame 544, portions of the support frame 544,or carrier 558, or a combination thereof are removed.

In other examples, the carrier 558 can be removed before removal ofmaterial from the mold 514 to form the flat mounting surface 520. Forinstance, the carrier 558 can be removed before formation of the flatmounting surface 520 where the mold 514 can provide sufficient supportto the electronic package or where the warpage of the mold 514 does notexceed acceptable tolerances for forming the flat mounting surface 520.In a further example, the carrier 558 can be removed prior to removingat least a portion of the support frame 544.

In examples where a via is located between the passive component 524 andthe flat mounting surface 520 (e.g., the first surface 516), an aperturecan be formed (e.g., drilled or laser drilled) in the mold 514 prior tothe formation of the first surface 520 or removal of material from theconductive pillar 508 and via to form the flat mounting surface 520. Forinstance, after the mold 514 is applied, an aperture can be drilled inthe mold 514. The lead 528 can be located at a first end of the apertureand an opening in the mold can be located at the second end of theaperture. A conductive material can be disposed within the aperture toform a via on the lead 528. Material can be removed from the mold 514,the conductive pillar 508, and the via to form the flat mounting surface520.

FIG. 6 is a block diagram illustrating an example machine 600(electronic device) upon which any one or more of the devices (e.g.,electronic packages 100, 200, 300, 400, or 500A-C) or techniquesdiscussed herein may perform. In alternative embodiments, the machine600 may operate as a standalone electronic device or may be connected(e.g., networked) to other machines. The machine 600 may be a personalcomputer (PC), a tablet PC, a set-top box (STB), a Personal DigitalAssistant (PDA), a mobile telephone, a web appliance, a network router,switch or bridge, watch, smartwatch, smart home system,internet-of-things device, or any machine capable of executinginstructions (sequential or otherwise) that specify actions to be takenby that machine. Further, while only a single machine is illustrated,the term “machine” shall also be taken to include any collection ofmachines that individually or jointly execute a set (or multiple sets)of instructions to perform any one or more of the methodologiesdiscussed herein, such as cloud computing, software as a service (SaaS),other computer cluster configurations.

Examples, as described herein, may include, or may operate on, logic ora number of components, modules, or mechanisms. Modules are tangibleentities (e.g., hardware) capable of performing specified operations andmay be configured or arranged in a certain manner. In an example,circuits may be arranged (e.g., internally or with respect to externalentities such as other circuits) in a specified manner as a module. Inan example, the whole or part of one or more computer systems (e.g., astandalone, client or server computer system) or one or more hardwareprocessors may be configured by firmware or software (e.g.,instructions, an application portion, or an application) as a modulethat operates to perform specified operations. In an example, thesoftware may reside on a machine readable medium. In an example, thesoftware, when executed by the underlying hardware of the module, causesthe hardware to perform the specified operations.

Accordingly, the term “module” is understood to encompass a tangibleentity, be that an entity that is physically constructed, specificallyconfigured (e.g., hardwired), or temporarily (e.g., transitorily)configured (e.g., programmed) to operate in a specified manner or toperform part or all of any operation described herein. Consideringexamples in which modules are temporarily configured, each of themodules need not be instantiated at any one moment in time. For example,where the modules comprise a general-purpose hardware processorconfigured using software, the general-purpose hardware processor may beconfigured as respective different modules at different times. Softwaremay accordingly configure a hardware processor, for example, toconstitute a particular module at one instance of time and to constitutea different module at a different instance of time.

The machine (e.g., computer, or computer system) 600 may include ahardware processor 602 (e.g., a CPU, GPU, a hardware processor core, orany combination thereof), a main memory 604, and a static memory 606,some or all of which may communicate with each other via an interlink(e.g., bus) 608. The machine 600 may further include a display device610, an alphanumeric input device 612 (e.g., a keyboard), and a userinterface (UI) navigation device 614 (e.g., a mouse). In an example, thedisplay device 610, input device 612 and UI navigation device 614 may bea touch screen display. The machine 600 may additionally include a massstorage device (e.g., drive unit) 616, a signal generation device 618(e.g., a speaker), a network interface device 620, and one or moresensors 621, such as a global positioning system (GPS) sensor, compass,accelerometer, or other sensor. The machine 600 may include an outputcontroller 628, such as a serial (e.g., universal serial bus (USB),parallel, or other wired or wireless (e.g., infrared (IR)) connection tocommunicate or control one or more peripheral devices (e.g., a printer,card reader, etc.).

The mass storage device 626 may include a machine readable medium 622 onwhich is stored one or more sets of data structures or instructions 624(e.g., software) embodying or utilized by any one or more of thetechniques or functions described herein. The instructions 624 may alsoreside, completely or at least partially, within the main memory 604,within static memory 606, or within the hardware processor 602 duringexecution thereof by the machine 600. In an example, one or anycombination of the hardware processor 602, the main memory 604, thestatic memory 606, or the mass storage device 616 may constitute machinereadable media.

While the machine readable medium 622 is illustrated as a single medium,the term “machine readable medium” may include a single medium ormultiple media (e.g., a centralized or distributed database, and/orassociated caches and servers) that arranged to store the one or moreinstructions 624.

The term “machine readable medium” may include any medium that iscapable of storing, encoding, or carrying instructions for execution bythe machine 600 and that cause the machine 600 to perform any one ormore of the techniques of the present disclosure, or that is capable ofstoring, encoding or carrying data structures used by or associated withsuch instructions. Non-limiting machine readable medium examples mayinclude solid-state memories, and optical and magnetic media. In anexample, a massed machine-readable medium comprises a machine-readablemedium with a plurality of particles having resting mass. Specificexamples of massed machine-readable media may include: non-volatilememory, such as semiconductor memory devices (e.g., ElectricallyProgrammable Read-Only Memory (EPROM), Electrically ErasableProgrammable Read-Only Memory (EEPROM)) and flash memory devices;magnetic disks, such as internal hard disks and removable disks;magneto-optical disks; and CD-ROM and DVD-ROM disks.

The instructions 624 may further be transmitted or received (e.g.,transceived) over a communications network 626 using a transmissionmedium via the network interface device 620 utilizing any one of anumber of transfer protocols (e.g., frame relay, internet protocol (IP),transmission control protocol (TCP), user datagram protocol (UDP),hypertext transfer protocol (HTTP), etc.). Example communicationnetworks may include a local area network (LAN), a wide area network(WAN), a packet data network (e.g., the Internet), mobile telephonenetworks (e.g., cellular networks), Plain Old Telephone (POTS) networks,and wireless data networks (e.g., Institute of Electrical andElectronics Engineers (IEEE) 602.11 family of standards known as Wi-Fi®,IEEE 602.16 family of standards known as WiMAX®), peer-to-peer (P2P)networks, among others. In an example, the network interface device 620may include one or more physical jacks (e.g., Ethernet, coaxial, orphone jacks) or one or more antennas to connect to the communicationsnetwork 626. In an example, the network interface device 620 may includea plurality of antennas to wirelessly communicate using at least one ofsingle-input multiple-output (SIMO), multiple-input multiple-output(MIMO), or multiple-input single-output (MISO) techniques. The term“transmission medium” shall be taken to include any intangible mediumthat is capable of storing, encoding or carrying instructions forexecution by the machine 600, and includes digital or analogcommunications signals or other intangible medium to facilitatecommunication of such software.

Various Notes & Examples

Each of these non-limiting examples may stand on its own, or may becombined in various permutations or combinations with one or more of theother examples. To better illustrate the method and apparatusesdisclosed herein, a non-limiting list of embodiments is provided here:

Example 1 is a face-up fan-out electronic package comprising: a diehaving a first side and a second side; a plurality of conductivepillars, each conductive pillar including a proximal end communicativelycoupled to the first side of the die and a distal end opposite theproximal end; a mold at least partially surrounding the die, the moldincluding a first surface that is coplanar with the distal end of theconductive pillars and a second surface opposing the first surface; apassive component including a body and a lead, the passive component islocated within the mold, and the lead is coplanar with the firstsurface, wherein the body is located at a distance from the secondsurface: and a support located between the body and the second surface.

In Example 2, the subject matter of Example 1 optionally includes arouting layer electrically coupled to the distal end of the conductivepillar.

In Example 3, the subject matter of any one or more of Examples 1-2optionally include wherein the passive component is a first passivecomponent, and the electronic package further comprises a second passivecomponent, the first passive component is located on the support,wherein the support is a first support, and the second passive componentlocated on a second support, the first support including a differentheight than the second support.

In Example 4, the subject matter of any one or more of Examples 1-3optionally include an adhesive coupled between the passive component andthe support.

In Example 5, the subject matter of any one or more of Examples 1-4optionally include a support frame, the support frame located along thesecond surface of the mold and coupled to the support, wherein thesupport frame holds the support or a plurality of supports in fixedrelation with respect to the support frame.

In Example 6, the subject matter of Example 5 optionally includeswherein the support frame is electrically coupled to the die andconfigured as a ground plane.

In Example 7, the subject matter of any one or more of Examples 5-6optionally include wherein the support frame is thermally coupled to thesecond die side and configured as a heat sink.

In Example 8, the subject matter of any one or more of Examples 5-7optionally include wherein the support frame includes a die holder, thedie holder configured to anchor the die with respect to the support.

In Example 9, the subject matter of any one or more of Examples 5-8optionally include wherein the support frame is exposed through thesecond surface of the mold.

In Example 10, the subject matter of any one or more of Examples 1-9optionally include a via located between the lead and the secondsurface, the via including a first end and a second end, wherein thefirst end is coplanar with the first surface.

In Example 11, the subject matter of any one or more of Examples1-optionally include the second side of the die is exposed through thesecond surface of the mold.

In Example 12, the subject matter of any one or more of Examples 1-11optionally include wherein the support includes a first end and a secondend, wherein the second end is exposed through the second surface of themold.

In Example 13, the subject matter of any one or more of Examples 1-12optionally include wherein the support is thermally coupled to thesecond die side and configured as a heat sink.

Example 14 is a method of making a face-up fan-out electronic packagehaving embedded passive components, the method comprising: attaching asupport frame to a carrier, wherein the support frame includes at leastone support, the support can include a first end and a second end, thesecond end can be coupled to the support frame and the first end can belocated opposite of the second end; attaching a die to the support frameor the carrier, wherein the die includes a first side and a second side,the first side can include a conductive pillar; placing a passivecomponent on the first end of the support, the passive componentincluding a lead; disposing a mold over the die, the passive component,and the conductive pillar, the mold including a first surface opposing asecond surface, the second surface located along the second die side;removing material from the mold to expose the conductive pillar and forma flat mounting surface, wherein the conductive pillar is coplanar withthe mold; and removing the carrier from the electronic package.

In Example 15, the subject matter of Example 14 optionally includeswherein attaching the support frame includes attaching a support framepanel to the carrier, the support frame panel including a plurality ofsupport frames.

In Example 16, the subject matter of Example 15 optionally includeswherein attaching the die includes attaching a plurality of dies, atleast one die is coupled to each respective support frame of the supportframe panel.

In Example 17, the subject matter of Example 16 optionally includesseparating the support frame panel and mold into a plurality ofelectronic packages, each electronic package including at least one die,at least one support, and at least one passive component.

In Example 18, the subject matter of any one or more of Examples 14-17optionally include wherein attaching the die to the carrier includesreleasably attaching the die to the carrier.

In Example 19, the subject matter of any one or more of Examples 14-18optionally include wherein attaching the die to the support frame or thecarrier includes locating the die within a die holder of the supportframe.

In Example 20, the subject matter of any one or more of Examples 14-19optionally include removing at least a portion of the support frame fromthe second surface of the mold.

In Example 21, the subject matter of any one or more of Examples 14-20optionally include wherein removing material from the mold to expose theconductive pillar and form a flat mounting surface further comprisesremoving material from the conductive pillar and the lead, wherein theconductive pillar and the lead are coplanar with the mold.

In Example 22, the subject matter of any one or more of Examples 14-21optionally include a dielectric layer disposed on the first surface ofthe mold and a routing layer electrically coupled to the conductivepillar or the lead, the routing layer disposed on the dielectric layer.

In Example 23, the subject matter of any one or more of Examples 14-22optionally include drilling an aperture in the mold, wherein the lead islocated at a first end and the aperture has an opening in the mold at asecond end; disposing a conductive material within the aperture to forma via on the lead; and wherein removing the material from the mold andconductive pillar includes removing a portion of the via to form theflat mounting surface.

Example 24 is a face-up fan-out electronic package constructed from anyone of the method Examples 14-23.

Example 25 is an electronic device including the face-up fan-outelectronic package of Example 24.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code can be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media can include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMs), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

What is claimed is:
 1. A device comprising: a die having a first sideand a second side; a conductive pillar including a first endcommunicatively coupled to the first side of the die and a second endopposite the first end; a mold at least partially surrounding the die,the mold including a first surface about the second end of theconductive pillar and a second surface opposing the first surface; apassive component including a body and a lead within the mold, the leadcoplanar with the first surface; and a support located between thepassive component and the second surface.
 2. The electronic package ofclaim 1, further comprising a routing layer electrically coupled to thesecond end of the conductive pillar.
 3. The electronic package of claim1, wherein the passive component is a first passive component, and thedevice further comprises a second passive component, the first passivecomponent is located on the support, wherein the support is a firstsupport, and the second passive component located on a second support,the first support including a different offset from the first surfacethan the second support.
 4. The electronic package of claim 1, furthercomprising an adhesive coupled between the passive component and thesupport.
 5. The electronic package of claim 1, further comprising asupport frame, the support frame located along the second surface of themold and coupled to the support, wherein the support frame holds thesupport or a plurality of supports in fixed relation with respect to thesupport frame.
 6. The electronic package of claim 5, wherein the supportframe is electrically coupled to the die and configured as a groundplane.
 7. The electronic package of claim 5, wherein the support frameis thermally coupled to the second die side and configured as a heatsink.
 8. The electronic package of claim 5, wherein the support frameincludes a die holder, the die holder configured to anchor the die withrespect to the support.
 9. The electronic package of claim 5, whereinthe support frame is exposed through the second surface of the mold. 10.The electronic package of claim 1, further comprising a via locatedbetween the lead and the second surface, the via including a first endand a second end, wherein the first end is coplanar with the firstsurface.
 11. The electronic package of claim 1, the second side of thedie is exposed through the second surface of the mold.
 12. Theelectronic package of claim 1, wherein the support includes a first endand a second end, wherein the second end is exposed through the secondsurface of the mold.
 13. A device comprising: a die having a first sideand a second side; a plurality of conductive pillars, each of theconductive pillars including a first end communicatively coupled to thefirst side of the die and a second end opposite the first end; a mold atleast partially surrounding the die, the mold including a first surfaceabout the second end of the conductive pillars and a second surfaceopposing the first surface; a passive component including a body and alead within the mold, the lead coplanar with the first surface; and asupport located between the passive component and the second surface.14. The electronic package of claim 13, further comprising a routinglayer electrically coupled to the second end of the conductive pillars.15. The electronic package of claim 13, wherein the passive component isa first passive component, and the device further comprises a secondpassive component, the first passive component is located on thesupport, wherein the support is a first support, and the second passivecomponent located on a second support, the first support including adifferent offset from the first surface than the second support.
 16. Theelectronic package of claim 13, further comprising an adhesive coupledbetween the passive component and the support.
 17. The electronicpackage of claim 13, further comprising a support frame, the supportframe located along the second surface of the mold and coupled to thesupport, wherein the support frame holds the support or a plurality ofsupports in fixed relation with respect to the support frame.
 18. Theelectronic package of claim 17, wherein the support frame iselectrically coupled to the die and configured as a ground plane. 19.The electronic package of claim 17, wherein the support frame isthermally coupled to the second die side and configured as a heat sink.20. The electronic package of claim 17, wherein the support frameincludes a die holder, the die holder configured to anchor the die withrespect to the support.